Wafer probe card has multiple isolation layers on which thousands of fine holes should be drilled for probe pin to go through. This stage is used to move the isolation layer to the accurate position and the holes are drilled by laser beam. Stage specification ITEM X axis (up) Yaxis(down) Z axis Stroke Effective …
Ultra-precision laser drill stage for wafer probe card Read More »
Advanced packaging of semiconductor has been the trend to increase the number of transistors per unit area. Either stack a chip on the wafer or directly bond two wafers together, this requires a stage which can perform pitch and roll adjustment. In addition, this stage should be equipped with the force feedback mechanism to ensure …
Line-scan image capture is often adopted for the wafer defect inspection. Besides high accuracy, the stage used for wafer positioning also requires good speed stability, otherwise, the captured image may be distorted due to speed variation. This stage is developed for this application. ITEM X axis Y axis Stroke Effective (mm) 390 390 Maximal (mm) …
Ultra precision positioning stage for line-scan wafer inspector Read More »
Electron-beam microscope needs to be operated in the vacuum environment of 10e-7 Torr. Besides the high vacuum compatibility to prevent outgassing, the stages used in this environment must solve the problem of heat dissipation produced by motors. By using special decoupling mechanism, the motor windings of this stage are all stationary so that the heat …
Ultra precision positioning stage for electron-beam microscope Read More »
Flip chip bonder pertaining to the back-end packaging of semiconductor eliminates the wire bonding process by flipping and placing the chip to the substrate and applying high pressure and heat to soldering the chip directly. The stage used for chip pick and place requires not only high speed but also has good pressure controllability. The …
Optical lens dispenser is to use the surface tension of a glue drop to form the secondary optical lens directly on the LED wafer. It removes the process of mounting injected secondary optical lens on a separate LED chip for shortening the manufacturing process and cutting the cost. ITEM X axis (up) Yaxis(down) Z axis …
XYZ precision stage for optical lens dispenser on LED wafer Read More »
